产品展示

· 适合低、长线弧产品

  Suitable low and long loop

· 适合所有高速键合机

  Suitable for high speed bonding

· 中等强度产品

  The medium strength wire

· 线弧稳定

  Stable loop

· 稳定的强形和热稳定性好

  Slable loop and good thermal stabiity

· 好的高温强度

  Good high temp strength

· 优秀的金属间化合物的稳定性

  Excellent stability of lMC

· 适合各种成分组成覆铝层、具有极佳的稳定性

  Suitable for a variety PAD with excellent stability

· 适合生产超细产品、同样适合大功率器件

  Suitable ultra-fine wire, suitable high-powerdevices

· FAB硬度低

  FAB harness is low

· 低电阻率

  Low resis tivity

· 高可靠性型号键合金丝

  High reliabiity type gold wire

· 高强度 、线弧稳定性高

  High strength ,high stability loop

· 很高拉力和剪切力

  High pull and shear strength

· 适合低 、长线弧产品

  Suitable for low and long loop

· 金属间化合物生长缓慢

  iMC grow slowly

· 热稳定性高

  High thermal stabiity

· 优秀的第一和第二焊点性能

  Excellent fist and second bond perfomance

· 铝层挤出少

  Less extrusion ofAl layer

· 第二焊点工艺参数窗口大

  The second bond process window is wider

· 线材和FAB硬度低

  Wre and FAB hardness are low

· 优秀的导电性和热稳定性

  Excellent conductivity and thermal stabiity

· 在保护气流量中成球稳定

  The stable FAB in forming gas

· 拉力值高

  High pull strength

· 第二焊点工艺窗口比铜线宽

  The slitch bond window is wider than copper wire

· 好的机械性能

  Good mechanical properties

· 适合SSB/ RSSB键合

  Suitable for SSB/RsSB bonding

· 第二焊点焊接强度高

  The high strength stitch bond

· 较高的拉力值

  The higher pul sirength

· 第二焊点工艺窗口比镀钯铜线宽

  The stitch bond window is wider than pd-copper wire

· 产品直径广0.6 mil -2.0 

  milThe wider dia. 0.6mi.2.0mil

· FAB硬度低

  FAB hardness is low

特性优点 Features and advantages

· 比银合金线有效期更长

  Longer sheif life than sikver alloy wire

· 可以在无保护气下键合

  Can be bonded without forming gas

· 抗冷热冲击优于银合金线

  Theral shock tost is better than sllveralloy wire

· 键合的MTBA优于银合金线

  MTBA is betier than siver nloy wire

· 更高的第二焊点作业性和工艺窗口

  Higher second bond workability and process windoww

特性优点

· 一种替代金丝的低价值丝

  A, low.value wire that repinces gold wire

· 较高的BST和SPT

  Hghcr BsT and PT

· 高温高下较高的BST和SPT

  Higher BsT and SPT under high temperature andhumdty

· 表面反射率高

  High suriace renectivity

· 在M戏H/N下有很好的键合性

  Good bonding in N, or H/N.