键合金丝 /Gold bonding wire 4N(99.99%)
· 适合低、长线弧产品
Suitable low and long loop
· 适合所有高速键合机
Suitable for high speed bonding
· 中等强度产品
The medium strength wire
· 线弧稳定
Stable loop
· 稳定的强形和热稳定性好
Slable loop and good thermal stabiity
· 好的高温强度
Good high temp strength
键合金丝 /Gold bonding wire 3N(99.9%)
· 优秀的金属间化合物的稳定性
Excellent stability of lMC
· 适合各种成分组成覆铝层、具有极佳的稳定性
Suitable for a variety PAD with excellent stability
· 适合生产超细产品、同样适合大功率器件
Suitable ultra-fine wire, suitable high-powerdevices
· FAB硬度低
FAB harness is low
· 低电阻率
Low resis tivity
键合金丝 /Gold bonding wire 2N(99.9%)
· 高可靠性型号键合金丝
High reliabiity type gold wire
· 高强度 、线弧稳定性高
High strength ,high stability loop
· 很高拉力和剪切力
High pull and shear strength
· 适合低 、长线弧产品
Suitable for low and long loop
· 金属间化合物生长缓慢
iMC grow slowly
· 热稳定性高
High thermal stabiity
超软铜丝.Super-soft copper wire
· 优秀的第一和第二焊点性能
Excellent fist and second bond perfomance
· 铝层挤出少
Less extrusion ofAl layer
· 第二焊点工艺参数窗口大
The second bond process window is wider
· 线材和FAB硬度低
Wre and FAB hardness are low
· 优秀的导电性和热稳定性
Excellent conductivity and thermal stabiity
键合钯铜丝: PD-copper wire
· 在保护气流量中成球稳定
The stable FAB in forming gas
· 拉力值高
High pull strength
· 第二焊点工艺窗口比铜线宽
The slitch bond window is wider than copper wire
· 好的机械性能
Good mechanical properties
· 适合SSB/ RSSB键合
Suitable for SSB/RsSB bonding
键合金钯铜丝 AUPD copper wire
· 第二焊点焊接强度高
The high strength stitch bond
· 较高的拉力值
The higher pul sirength
· 第二焊点工艺窗口比镀钯铜线宽
The stitch bond window is wider than pd-copper wire
· 产品直径广0.6 mil -2.0
milThe wider dia. 0.6mi.2.0mil
· FAB硬度低
FAB hardness is low
键合合金丝(镀金银合金丝) Alloy bonding wire
特性优点 Features and advantages
· 比银合金线有效期更长
Longer sheif life than sikver alloy wire
· 可以在无保护气下键合
Can be bonded without forming gas
· 抗冷热冲击优于银合金线
Theral shock tost is better than sllveralloy wire
· 键合的MTBA优于银合金线
MTBA is betier than siver nloy wire
· 更高的第二焊点作业性和工艺窗口
Higher second bond workability and process windoww
键合合金丝(>98%)
特性优点
· 一种替代金丝的低价值丝
A, low.value wire that repinces gold wire
· 较高的BST和SPT
Hghcr BsT and PT
· 高温高下较高的BST和SPT
Higher BsT and SPT under high temperature andhumdty
· 表面反射率高
High suriace renectivity
· 在M戏H/N下有很好的键合性
Good bonding in N, or H/N.
